JSTQE on Hybrid Integration for Silicon Photonics

Submission Deadline: August 1 (Sun), 2021
Hard Copy Publication: May/June, 2022
Call for Papers

The IEEE Journal of Selected Topics in Quantum Electronics (JSTQE) invites manuscript submissions in Hybrid Integration for Silicon Photonics which is an advanced field of modern photonic integrated circuit (PIC) development by large scale accompanied with the ever added functionalities through the heterogenous integration and packaging by incorporating various best in-class materials and chips/chip-lets in order to meet the future products with new application demands, beyond the current industry focus on optical-interconnects centric transceiver alike. The IEEE Journal of Selected Topics in Quantum Electronics (JSTQE) invites manuscript submissions in the area of Hybrid integration for Silicon Photonics. The purpose of this issue of JSTQE is to highlight the recent progress in both research and development trend and industrial product implementation prospects, challenges and opportunities ahead, especially the new application demands and requirements on hybrid photonics platforms. Areas of interest include (but not limited to):
・ Silicon photonics hybrid integration and advancement
・ Heterogeneous integration scheme, such as through: Growth, Bonding, Membrane Transfer, etc.
・ Silica, silicon nitride-, AlN-photonics, etc.
・ Hybrid Integrated materials, such as: InP, LiNbOx, VOx, Magneto-optic material, Phase-Change-Materials, etc.
・ Optical-, Opto-Electronics interposers, and chip-lets, Co-Packaging
・ Advanced Active Devices, e.g., Modulators, Tunable lasers
・ Optical interconnects, telecommunications
・ Microwave photonics
・ Photonic sensors, LiDAR
・ Optical Computing, AI and Deep-Learning
・ Quantum Photonics and Applications
・ Hybrid Integration and O/E IC Packaging (incl. Co-Packaging)
・ Product Development effort and Status

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