JLT Special Issue on Optical Interconnects

Submission Deadline: October 15 (Tue), 2019
Hard Copy Publication: March/April 2020
Call for Papers (Jump to IEEE-JLT Web Page)

Large-scale data centers and high-performance computers (HPC) are becoming increasingly limited by the capacity of interconnects due to the rapidly increasing power consumption and bandwidth demands. As a result of the continuing bandwidth scaling, optical interconnects (OI) have been implemented at ever decreasing communication distances to replace electrical interconnects. Over the past decade, core switches and routers in data centers and HPC systems have adopted fiber optics to deliver the I/O performance between racks in multi-chassis configurations. Meanwhile, the further penetration of OI into shorter distances, such as the board and chip levels, poses new challenges and needs on photonics technologies and further requires innovations in integration and packaging techniques.
This special issue of the Journal of Lightwave Technology covers all aspects in frontier research, technologies and perspectives of next generation optical interconnects that address the rising requirements. Potential topics include: integrated photonics roadmaps, network systems, architectures, subsystems, devices, new optical materials, integration, photonic packaging, testing, and applications.
A portion of this issue will feature expanded versions of papers presented at the 2019 IEEE Optical Interconnects Conference in Sante Fe, New Mexico, United States from April 24-26, 2019. The special issue will include both invited and contributed submissions. It will have an emphasis on, but not limited to, work presented at the 2019 IEEE Optical Interconnects Conference.

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