CPMTComponents, Packaging, and Manufacturing
　　　　　　　　　　　　　　　　　Technology Society

 

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IEEE CPMT Society Japan Chapter

The objective of IEEE CPMT Society Japan Chapter is to promote scientific researches and knowledge exchanges among its members in the fields of various kinds of electrical parts and materials, the cutting-edge process technology, packaging technology and industrial technology. These are essential for realizing the state of art communication and information processing equipment and terminal equipment which will support the multi-media society in the coning millennium. Through the researches and the knowledge exchanges, we promote the development of the industrial society. Several international conferences, such as ICEP Symposium, are held annually in which the members present their recent researches and discuss vigorously. Sometimes, the symposiums on hot subjects are organized under cooperation with related societies to promote timely studies. Membership in IEEE CPMT Society Japan Chapterr provides the latest technical information and various discounts. Join us today.

Technical Area

Foundation Technologies
　-Materials
　-Reliability
　-Thermal Management and Thermomechanical Design
　-Technology Trends
　-Education

Components and Devices
　-Electrical Contacts, Connectors and Cable
　-Discrete and Integrated Passives
　-Fiber Optics and Photonics

Packaging
　-IC and Package Assembly
　-High Density Board Packaging
　-Power Electronics Packaging
　-Systems Packaging
　-RF and Wireless
　-MEMS and Sensor Packaging
　-Wafer Level Packaging

Process and Manufacturing
　-Manufacturing Design and Process
　-Semiconductor Processing and Manufacturing
　-Electrical Test
　-Electrical Design, Modeling and Simulation
　-Design and Manufacturing Engineering
　-Environment, Health & Safety

The Officials

Chair:       Prof. Tadatomo Suga
　　　　　　　The University of Tokyo
                School of Engineering
　　　　　　　Tel: 81-3-5841-649
　　　　　　　E-mail: suga@(removehere)pe.u-tokyo.ac.jp

Vice Chair: Dr. Yasuhiro Andou
　　　　　　　FUJIKURA Ltd., Optoelectronic Circuits & Systems R&D Center
          Tel: +81-3-5606-1473
          E-mail: yando@(removehere)fujikura.co.jp

Secretary: Hiroshi  Yamada
　　　　　　　Toshiba Corporation
　　　　　　　Corporate Research & Development Center
  　　　　　　Tel： 81-44-549-2141
　　　　　　　E-mail: hiroshi.yamada@(removehere)toshiba.co.jp

Treasurer: Hideyuki Oh-hashi
　　　　　　　Mitsubishi Electric Corporation
　　　　　　　Information Technology R & D Center
　　　　　　　Tel: 81-467-41-2966
　　　　　　　E-mail: Ohashi.Hideyuki@(removehere)dr.MitsubishiElectric.co.

Adviser: Prof. Kanji Otsuka
　　　　　 Meisei University
　　　　　 Dep. of Electronics and Computer Sciences
　　　　　 Tel: 81-428-25-5214
　　　　　 E-mail: otsuka@(removehere)ei.meisei-u.ac.jp

Adviser: Dr. Naoaki Ymanaka
　　　　　 Keio University
            Dep. of Science and Technology
　　　　　 Tel: 81-45-560-1263
　　　　　 E-mail: yamanaka.naoaki@(removehere)lab.ntt.co.jp

Operating Support

TC-6 Chair & CPMT BOG Member:
Dr. Yoshitaka Fukuoka
Worldwide Electronic Integrated Substrate Technology Inc.
Tel: 81-3-3475-0755
E-mail: weisti.fukuoka@(removehere)rose.zero.ad.jp


CPMT BoG Member :
 Dr Koshio Yokouchi

                 Fujitsu Laboratoris Ltd.
                 E-mail: yokouchi.kishio@(removehere)jp.fujitsu.com

       Kaoru Hashimoto
       Japan Institute Electronics Packing (JIEP)
       E-mail: hashimoto@(removehere)jiep.or.jp


SYMPOSIUM, CONFERENCE, WORKSHOP

8th VLSI Packaging Workshop (Dec. 4-5, 2006)

Polytronic 2007 (Jan. 16-18,2007)

ICEP 2007

PAST SYMPOSIUM, CONFERENCE, WORKSHOP
7th VLSI Packaging Workshop (Nov. 30-Dec. 2, 2004)
4th CPMT Japan Packaging Technology Seminar (Nov. 29, 2004)

2006 ICEP (Apr. 19-21, 2006)   
             -->IEEE CPMT Young Award

1st IEEE CPMT Society Japan Evening Meeting

　

LINKs

　　IEEE CPMT Society

　　IMAPS

　　Japan Institute Electronics Packing (JIEP)

　　　　　　　　　　[ IEEE Tokyo Section Home Page]

Last revised Wed, 28-JSeptember-2006