2008年 第２回技術講演会 LSIの物理設計技術に関する最新動向
Ting-Chi Wang先生を講師にお招きして講演会を開催しました．
- 日時
- 2008年12月15日（月） 15:00–16:50
- 会場
-
メルパルク京都 ５階 会議室Ｂ
600-8216
京都府 京都市 下京区東塩小路町６７６ー１３
15:00–16:50 Post-routing Double Via Insertion
- 概要
- Redundant via insertion employed in the post-routing stage is highly recommended to improve chip yield and reliability. In this lecture, the recent promising results from my research group in the problem of double via insertion with or without bending wires will be presented. In addition, how to take via density into account during double via insertion will be also discussed.
- 講演者
-
Thing-Chi Wang
(National Tsing Hua University)
略歴
Ting-Chi Wang received the B.S. degree in Computer Science and Information Engineering from National Taiwan University, Taiwan, and the M.S. and Ph.D. degrees in Computer Sciences from the University of Texas at Austin, USA. He is currently an Associate Professor in the Department of Computer Science, National Tsing Hua University, Taiwan. His main research interest is in VLSI physical design automation. He received a Best Paper Award from 2006 ASP-DAC for his work on redundant via insertion. He supervised a team to win the first place at 2008 ISPD Global Routing Contest. He has served on the technical program committees of several conferences/workshops, including ASP-DAC, FPL, FPT, ICCAD, and SASIMI.
