Dear Colleagues and Friends We would like to invite you to submit a presentation and participate to the upcoming 2010 SPJW "Systems Packaging Japan Workshop"
that will be held in Kyoto, Japan on January 25 - 27, 2010. | ||||
SCOPE In recent years, technological progress in packaging design and materials has become critical to allow the operation of systems
at higher frequencies and obtain better performance.
SPJW is held every other year and 2010 SPJW will be the thirteenth workshop since the first meeting,
called "IEEE Japan Computer Packaging Workshop", was held in 1986. State-of-the-art technologies in all areas of systems packaging,
ranging from LSI packages to super high performance system, will be covered in the workshop
( Workshop History [pdf,676kB] ).
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TOPICS
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Kyoto gosho Copyright(C) Akira Okada/ (C)JNTO | |||
Welcome Reception The welcome reception will be held at Daimonji, the Japanese restaurant located at the top floor of the venue. [JPEG image, Original Image:2.3MB] *Click the right button of your mouse, then select "Save the link as...". You can save the original image file. | ||||
Technical Tour Technical tour is scheduled on the last day of the workshop, planning to visit
ATR (Advanced Telecommunications Research Institute International). [JPEG image, Original Image:2.1MB ] *Click the right button of your mouse, then select "Save the link as...". You can save the original image file. | ||||
Registration Participants are requested to complete the
Registration Form ( Web-registration : CLOSED ) . | ||||
IMPORTANT DATES [1] Abstract submission: | ||||
VENUE & ACCOMMODATION The workshop will be held at Mielparque Kyoto [pdf,324kB], which is close to the central exit of the JR Kyoto station ( Access to Kyoto [pdf,56kB], Map and Access [pdf,188kB] ). Hotels near Mielparque Kyoto can be reserved at the WEB: CLOSED. | ||||
ORGANISERS General Chair: Seiichi Saito, Mitsubishi Electric Corporation [ E-mail: spjwtcpDeleteThis@rf.MitsubishiElectric.co.jp (Remove "DeleteThis") ] Co-General Chair: Michitaka Kimura, Renesas Technology Corp. Vice General Chair: Shigeyuki Ogata, Oki Printed Circuits Co., Ltd., Program Chair: Yoichi Taira, IBM Japan Co.,Ltd., Treasurer: Hideki Ohashi, Mitsubishi Electric Corporation |
Japanese Committee: | |
Yoshitaka Fukuoka, WEISTI Yuzo Shimada, NEC Patent Service, Ltd. Tohru Kishimoto, NTT Advanced Technology Yutaka Tsukada, i -Packs Kenji Terada, Kyocera SLC Technologies Corp. Ryoji Ninomiya, Toshiba Corporation Hiroshi Go, Hitachi Ltd. Haruhiko Yamamoto, Fujitsu ICT, Ltd. (Kishio Yokouchi, Fujitsu ICT, Ltd. ) Secretariat (Mitsubishi Electric Corporation) [ E-mail: spjwsecretaryDeleteThis@rk.MitsubishiElectric.co.jp (Remove "DeleteThis") ] Hideki Ohashi Keitaro Yamagishi | |
US/European/Asian Committee: | |
George A. Katopis, IBM Corporation Robert C. Pfahl, National Electronics Manufacturing Initiative Thomas-Michael Winkel, IBM Germany Rolf Aschenbrenner, Fraunhofer IZM. Eric Beyne, IMEC Ricky Lee, The Hong Kong University of Science and Technology Kim, Seo Young, Korea Institute of Science and Technology Shlomo Novotny, Vette Corp. Stefano Oggioni, IBM Italy |