IEEE EDS Japan Chapter 会員各位

IEEE EDS Kansai Chapter 会員各位

IEEE Electron Devices Society Japan Chapter

Chair 小柳 光正

Vice Chair 木村 紳一郎

*** EDS DL講演会のお知らせ ***

EDS Japan Chapter主催の下記DL(Distinguished Lecturer)講演会を開催致します。

多くの皆様にご参加頂けますようご案内申し上げます。

【日時】 平成21年 2月5日（木）10:00−12:00

【場所】 東京工業大学 すずかけ台キャンパス

J2棟20階　中会議室

【講演者】Prof. Pey Kin Leong　（Nanyang Technological University）

【題目】 “Physical analysis of dielectric breakdown in SiON and high-k gate dielectric materials”

【講演者】Prof. Maimaitiyiming Aini　（新疆大学）

【題目】 “Thermal Deformation and Dynamic Stability Analysis of Support Structure with Periodic Nonsymmetrical Struts System”

■Abstract by Prof. KL Pey, Nanyang Technological University

Nano-scale physical analysis of breakdown in nano-scale high-? gate stacks consisting of either polycrystalline-silicon or metal as gate electrode shows that the microstructural defects and damages induced by breakdown in the high-? gate dielectric are different from that of conventional SiOxNy/ poly-Si and Si3N4/poly-Si gate stacks. Chemical analysis using transmission electron microscopy provides useful information about the nature and evolution of the breakdown induced defects in different gate stacks metal- oxide-semiconductor field effect transistors. Together with electrical characterization, the possible gate leakage conduction mechanism(s) in various dielectric breakdown has been established. This talks provide an overview of the breakdown conduction mechanism(s) and induced defects in high-? gate stacks in comparison to conventional gate dielectrics. The impacts of the new failure mechanisms on the performance and reliability of various gate stacks are discussed.

Biodata

Dr. PEY Kin Leong received his Bachelor of Engineering (1989) and Ph.D

(1994) in Electrical Engineering from the National University of Singapore.

He has held various research positions in the Institute of Microelectronics, Chartered Semiconductor Manufacturing, Agilent Technologies and National University of Singapore. He is currently a Full Professor, Head of the Microelectronics Division, Program Director of the Si Technology Research group, Laboratory Supervisor of the MicroFabrication Facility, and the Director of the Microelectronic Center in the School of Electrical & Electronics Engineering, Nanyang Technological University, Singapore, and holds a concurrent Fellowship appointment in the Singapore- MIT Alliance (SMA).

Dr. Pey is a senior member of IEEE and an IEEE EDS Distinguished Lecturer, and has been the organizing committee member of IPFA since 1995. He was the General Chair of IPFA2001, Singapore and the co-General Chair of IPFA2004, Hsinchu, Taiwan. KL Pey was the Guest Editor of IEEE Transactions on Devices in and Materials Reliability in 2003-05, and the Chair of the Singapore IEEE REL/CPMT/ED Chapter in 2004/05 and 2009 and served on the

2006/07/08 IRPS technical subcommittee, and the IPFA’02 to IPFA’06 and

IPFA’08 technical committee, and the 2007 IEDM CMOS & Interconnect Reliability and 2008 IEDM Characterization, Reliability and Yield sub- committee.

Dr. Pey has published more than 140 international refereed publications and 140 technical papers at international meetings/conferences and holds 33 US patents.

■Abstract by Prof. Maimaitiyiming Aini, School of Mechanical Engineering, Xinjiang University

In gas turbine the hot gas emanating from the gas generator and received by the power turbine. The thermal stress developed in the support structure reaches high levels due to attainment of high temperature. In the present study, flow through an exhaust diffuser part including the outer and inner casing, periodic nonsymmetrical struts and support bearing part are modeled.

The hot gas passing area and the cooling steam area also modeled for evaluating the high speed heat flow stream and its transfer process. Heat stream flow field and heat transfer process as will as thermal deformation of the support structure with periodic nonsymmetrical struts system under the high temperature, high speed and huge bearing load conditions are analyzed, and the thermal stress levels and the effect of thermal deformation on the center elevation problem is discussed. Then the modal analysis conducted for analysis of dynamic stability. The natural frequencies and mode shapes of the first several modes are discussed by modal analysis. Finally, presents a different system of support structure with different struts system and its thermal deformation and stress distributions are discussed. The Finite element analysis (FEA) method is employed based on the thermal and dynamic theory. In the FEA method the stream and temperature flow field coupled with thermal conductivity and thermal deformation field of solids.

【連絡先】岩井研究室　TEL（045）924-5471

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IEEE EDS Japan Chapter連絡先: Secretary 田中　徹

E-mail:　ttanaka@ieee.org

Home page:　http://www.ieee-jp.org/section/tokyo/chapter/ED-15/

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